In this example, a very thin circuit board with many needles had to be contacted. At the same time, an electromagnet had to be positioned directly above it when clamped, which made it difficult to hold it down from above. A mushroom-shaped geometry pops through a hole in the board and spreads out before the pins make contact. in order to also hold down the board in the middle. This is a good example of a combination of high-precision parts made using the Material Jetting (MJP) process and more flexible parts made using Selective Laser Sintering (SLS).